HO-107

Informacje o HO-107

Test additive manufacturing ? or 3D printing ? utilizing conductive polymers to perform the simulated repair of a solar array junction in orbit. Flight-demonstrate a 3D-printed capacitor and patch antenna, Electron Emission Film and Surface Charging Monitor.

Establish ground uplink/downlink communication though primary UHF link, Providing UTEP engineering students experiences in satellite tracking and communications / telemetry concepts. ? Demonstrate and observe operation of printing mechanism though visual (onboard camera) and electrical continuity validation. Secondary: ? Command S-Band DL transmission. Acquiring OF-2 printer data, sensor data and images. ? Demonstrate OF-2 software reconfiguration and RTOS reset via UHF UL. The S-band downlink is a demonstration and characterization activity for an experimental s-band antenna design. Designed to work in the S-band ISM band, this activity has the potential to extend the body of knowledge about S band antennas that would potentially support amateur operations.

Średnia inklinacja HO-107